Solder Flux No Clean 0% Rosin/Resin Free
It is recommended to be used in Dip Soldering Process.
It is recommended to be used in Wave Soldering Process.
Helps solder to “cling” to metal by removing oxide buildup. Also helps spread out solder by reducing surface tension. Liquid flux is crucial for surface mount soldering and de-soldering.
Low Post-Process Residues
Lead-free & tin-lead compatible
Apply to Circuit Boards by a spray, foam, or dip process.
Non Corrosive and Non-conductive.
No Surface Insulation degradation.
No offensive odors.
Compatible with all types of Solder.
– For wave soldering conventional and surface mount circuit board assemblies.
– NO RESIDUE will be left on the assembly after soldering.
– Boards will be dry and cosmetically clean as they exit the wave solder machine.
– Eliminate the problem of Short Circuits.